In Stock:
734
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 1 | 662.09 | |
| 10 | 648.8482 | |
| 100 | 628.9855 | |
| 1000 | 609.1228 | |
| 10000 | 582.6392 |
Specification
Speed500MHz, 1.2GHz
Width23mm
Length23mm
SeriesZynq® UltraScale+™ MPSoC EG
HTS Code8542.31.00.01
RAM Size1.8MB
PackagingTray
TechnologyCMOS
Part StatusActive
PeripheralsDMA, WDT
RoHS StatusROHS3 Compliant
ArchitectureMPU, FPGA
ConnectivityCANbus, I2C, SPI, UART/USART, USB
JESD-30 CodeS-PBGA-B784
Number of I/O128
Surface MountYES
Terminal FormBALL
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Package / Case784-BFBGA, FCBGA
Supply Voltage0.85V
Terminal Pitch0.8mm
Factory Lead Time11 Weeks
Terminal PositionBOTTOM
Primary AttributesZynq®UltraScale+™ FPGA, 154K+ Logic Cells
Height Seated (Max)3.32mm
Operating Temperature-40°C~125°C TJ
Number of Terminations784
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel)NOT SPECIFIED
Moisture Sensitivity Level (MSL)4 (72 Hours)
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
